KB PI-515G，環(huán)氧覆銅無鹵素板(FR4)采用優(yōu)質(zhì)玻璃纖維布及環(huán)氧樹脂經(jīng)無鹵工藝壓制而成,KB PI-515G TG150 同時不含鹵素,不含銻,不含紅磷,應用在環(huán)保要求較高的產(chǎn)品上.

特性：

●?無鹵,無銻,無紅磷,Tg190℃  Halogen,antimony and red phosphorous free Tg190℃ 

●?優(yōu)良的耐熱性 Excellent thermal reliability

●?低的Z軸熱膨脹系數(shù) Low Z-CTE

● 良好的耐CAF性能 Ati-CAF capability

●?符合IPC-4101B的規(guī)范要求?IPC-4101B?specification?is?applicable

應用領域：

●高端服務器 High-end Server

●背板 Backpanel

●無線通信設施 Wireless communication infrastructure

●高復雜度多層板 High complexity multi-layers

●高耐熱汽車板 Automotive applications requiring highthermal resistance

                            性能參數(shù)表